QPU Integration Engineer (Micro-Fabrication focused) (f/m/d)

eleQtron develops and operates full-stack quantum computers based on trapped-ion technology. Quantum computing is a new computing paradigm rapidly approaching commercial viability. Our unique approach combines laser-cooled trapped ions with microwave control and tailored magnetic fields. Our next-generation computing machines under development will be able to find solutions to problems that are out of reach today, thus enabling new innovative products and services for a brighter future.

Responsibilities:

• Serve as the Subject Matter Expert (SME) for critical FEOL/BEOL fabrication modules (e.g., advanced lithography, thin-film deposition, metal/dielectric stack etch, dielectric isolation, surface passivation, and interconnects).

• Lead end-to-end integration flows, evaluating and optimizing process interactions across multi-layer QPU stack architectures.

• Collaborate closely with QPU designers, device physics teams, and packaging specialists to translate architectural requirements into manufacturable Design Rules (DRC) and process design kits (PDKs).

• Feed cleanroom metrology, yield data, and failure analysis insights directly back into design and layout iterations.

• Take the lead in managing daily internal cleanroom fabrication activities, schedule runs, set process baselines, and resolve real-time process deviations.

• Oversee internal R&D projects to develop, qualify, and integrate novel materials, geometries, and process steps for next-gen QPU platforms.

• Drive technology development and project management with external commercial foundry partners and research institutes.

• Lead process transfer, yield matching, and contract negotiation for out-of-house fabrication and prototyping runs.

• Lead Root Cause Analysis (RCA) and Process Failure Mode and Effects Analysis (PFMEA) for critical integration failures, lot losses, or performance degradation.

• Define and maintain Statistical Process Control (SPC) guidelines, process windows, and target specifications across internal and external fabrication runs.

• Mentor junior fabrication engineers and technicians on advanced processing techniques, cleanroom protocols, and experimental design (DOE).

• Author comprehensive process specifications, standard operating procedures (SOPs), and technical roadmaps for executive and cross-functional review.

Required Skills:

• Master’s or Ph.D. in Microelectronics, Electrical Engineering, Materials Science, Applied Physics, Nanotechnology, or a related field.

• 5+ years (or equivalent extensive industry experience) of hands-on semiconductor or quantum hardware integration experience in a professional cleanroom environment (Class 10 / 100 / ISO 4–5).

• Deep technical expertise in both Front-End (FEOL) and Back-End (BEOL) module development (e.g., e-beam/optical lithography, PVD/ALD thin films, reactive ion etching (RIE/DRIE), planarization, lift-off processes, and flip-chip/interconnect technologies).

• Proven track record of taking complex solid-state micro/nano devices from initial R&D concept to stable, repeatable integration flows.

• Demonstrated experience in managing joint development projects (JDPs) or technology transfers with commercial external foundries or external fabrication partners.

• Strong project management capabilities, including timeline tracking, deliverable management, and milestone execution.

• Solid understanding of Statistical Process Control (SPC), Design of Experiments (DOE), PFMEA, and structured RCA techniques (e.g., 8D, Fishbone).

• Proficiency with layout and data tools (e.g., KLayout, Cadence, Python/MATLAB for yield and parametric analysis).

• Fluent in English (written and spoken) with excellent technical writing and presentation skills.

We value (Bonus):

• Experience in quantum hardware integration (e.g., superconducting circuits, trapped-ion traps, spin qubits, or photonic chips).

• Experience developing novel low-loss dielectric materials, superconducting interconnects, or 3D integration / TSV technologies.

• Proven experience establishing a cleanroom process baseline or setting up new-process lines/tools from scratch.

• Background in managing foundry contracts, IP considerations, and wafer delivery schedules.

• Competitive salary: We value our team members and therefore provide remunerations that reflect this, additionally rewarding achievements.

• Flexible working hours : We offer personal freedom through a variety of flexible work schedules

• Team spirit: In our international and diverse team, and with our regular team events, having fun at work is simply part of the culture

• Further development: We want to grow together and so we offer our team members needs-based, individualized further training as well as plenty of room for personal development

• Wellness Package : We offer health-promoting benefits such as fitness programs like UrbanSportsClub to support your well-being

• Bike Leasing: Stay Mobile and Sustainable with Our Company Bike Leasing Program

• Moving Benefits: A warm welcome! We are happy to support employees who move for us with a bonus

• At the forefront : Work at the forefront of technology, where academic research meets commercial applications

• Modern workplace: We have a high-quality infrastructure with laboratory space, offices and meeting rooms